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FLC Zbigniew Huber EN PL

Engineering services

Electronics failure analysis and cause identification

Our offer:

Engineering services related to failure analysis of electronic assemblies and possible cause(s) identification. Typical offer includes:
  • Failure identification
  • Detailed analysis of failed location. Depending on the nature of the issue, various tools are used from optical microscopy to SEM/EDS analysis
  • Identification of possible cause(s)
  • Recommendations for improvements

Example images from some of our analysis:

THT lead wetting issue X-ray of soldering issue SnCu intermetallic top view AgPd terminal leaching SnCu intermetallic EDS PCB via plating issue

Experience:

  • 24+ years of experience in electronics industry including manufacturing processes, testing and quality assurance
  • 12+ years of experience in electronics failure analysis services
  • Excellent knowledge of IPC-A-610 requirements and other related standards (CIT - Certified IPC Trainer for more than 10 years, IPC member)
  • Excellent practical knowledge of quality tools like: DFMEA, PFMEA, SPC, MSA/GR&R, DoE